Solder Wire, Form Flux-Cored Wire, Material Composition 99.3 Percent Tin, 0.7 Percent Copper, Wire Diameter 0.5 mm, Weight 500 g, Melting Temperature (Maximum) 442 Degrees F, Flux Type No-Clean, Flux Classification ROM1, Solder Series SC M1, For Joining Metal, Application High-Soldering Temperature, Container Type Spool
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