Application
Module-to-Board
Terminal Type
Through Hole - Compliant Pin
Hole Center to Center
0.8 mm
Material
High Temperature Thermoplastic
Terminal Finish
Matte Tin Plated
Contact Plating Thickness
0.762 µm
Contact Finish
Gold Plated
Durability (mating cycles max)
100
Material - Plating Termination
Matte Tin
Material - Plating Mating
Gold
Plating min - Mating
0.762µm
Product Name
zSFP Plus,zSFP+
Voltage - Maximum
30V AC (RMS)/DC
Current - Maximum per Contact
0.5A
Material - Resin
High Performance Thermoplastic
PCB Thickness - Recommended
1.57mm
Polarized to Mating Part
Yes
Pitch - Mating Interface
0.80mm
Temperature Range - Operating
-40° to +85°C
Material - Metal
High Performance Alloy (HPA)
Country of Origin (subject to change)
Indonesia
